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Green circuit board with black memory chips, gold edge connector, no heat spreader, SODIMM form factor

NEMIX RAM

NEMIX RAM 8GB DDR4 3200 CL22 260-PIN ECC SODIMM memory upgrade

SKU CH-XJJV-WF2EK

8GB DDR4 3200 ECC unbuffered SODIMM for Samsung systems with CL22 latency and 1.2V operation

  • Capacity8GB
  • SpeedDDR4 3200 (PC4 25600)
  • ECCYes
  • Buffered/RegisteredUnbuffered
  • ChipsetMajor OEM Samsung, Micron, Hynix
  • Voltage1.20V
  • ECC protection guards data integrity in critical workloads
  • 3200 MHz DDR4 speed matches PC4-25600 bandwidth
  • 20 V operation keeps power draw low
  • 260-pin SODIMM form factor fits compatible Samsung systems
  • CL22 latency with 1Rx8 rank for stable timing

8GB DDR4 ECC SODIMM for Samsung systems

This 8GB NEMIX RAM module delivers DDR4 3200 speed with CL22 latency and ECC error correction for data integrity. It operates at 1.2V using Samsung-compatible components in a 260-pin unbuffered SO-DIMM form factor. The single-rank 1Rx8 design suits compatible Samsung laptops, workstations or all-in-one PCs requiring registered reliability.

Suits ECC-capable Samsung mobile platforms

This module is built for Samsung systems that specifically support unbuffered DDR4 ECC SO-DIMMs at 3200 MT/s. Buyers whose platforms lack ECC support or require registered DIMMs should look elsewhere, as the error-correction circuitry will not function and the pin layout differs. Non-Samsung boards with strict vendor whitelists may also reject this part.

CL22 latency at DDR4 3200 defines throughput

The CAS latency of 22 cycles at 3200 MT/s sets the baseline access speed for this 8GB kit. Systems tuned for tighter timings will not gain from lower-latency alternatives unless the BIOS permits manual adjustment, which many locked OEM platforms do not. Verify your motherboard accepts CL22 before purchase.

Highlights

  • ECC protection guards data integrity in critical workloads
  • 3200 MHz DDR4 speed matches PC4-25600 bandwidth
  • 20 V operation keeps power draw low
  • 260-pin SODIMM form factor fits compatible Samsung systems
  • CL22 latency with 1Rx8 rank for stable timing

Specifications

BrandNEMIX RAM
SeriesSamsung Server/Workstation Compatible Series Memory
ModelSamsung DDR4 3200MHZ ECC Unbuffered SODIMM
Part NumberMSE25600-818K1
Capacity8GB
SpeedDDR4 3200 (PC4 25600)
ECCYes
Buffered/RegisteredUnbuffered
ChipsetMajor OEM Samsung, Micron, Hynix
Voltage1.20V
Compatible SystemSamsung
CAS LatencyCL22
Heat SpreaderNo
Type260-PIN DDR4 ECC SODIMM
Rank1Rx8
FeaturesDDR4 ECC Unbuffered SODIMM Motherboard Compatible
Package Content8GB (1X8GB) DDR4 3200MHZ PC4-25600 2Rx8 1.2V CL22 260-PIN ECC Unbuffered SODIMM

Questions about this item

Should I choose the 8 GB module or a different capacity?

This listing is for a single 8 GB DDR4 3200 ECC SODIMM. Add one module per available slot to reach the total memory your Samsung system supports.

What does the 3200 MHz rating deliver in daily use?

The module runs at 3200 MT/s with CL22 latency, providing the standard bandwidth and timing for DDR4 3200 SODIMM slots in compatible Samsung laptops or workstations.

Will the 260-pin ECC SODIMM work in a non-ECC consumer laptop?

This is a 260-pin DDR4 ECC unbuffered SODIMM. It requires a platform that accepts ECC memory; standard consumer laptops without ECC support will not recognise it.

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