OWC 2GB DDR3 1066 PC3-8500 CL7 1Rx8 204-pin 1.5V Non-ECC SODIMM memory upgrade for HP 430 620 625 630 635
- 2GB
- 204-Pin DDR3 Non-EC…
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OWC
A 2GB DDR3 SODIMM running at 1333MHz CL9 for compatible HP ProBook laptops
This 2 GB DDR3 SODIMM is built for HP ProBook 4720s 4730s 4740s 5310m and 5320m notebooks. It adds 2 GB of PC3-10600 memory at 1333 MHz with CL9 latency. The module is unbuffered non-ECC and runs at 1.5 V. Buyers who need more than 2 GB per slot should look at higher-capacity kits.
The stick has no heat spreader and draws power only through the 204-pin socket at the rated 1.5 V. Passive cooling inside the laptop chassis handles the thermal load without extra fan noise. Power consumption stays within the standard DDR3 envelope for this speed grade.
JEDEC and RoHS compliance make the upgrade warranty-safe for the listed ProBook models. OWC supplies a limited lifetime warranty with free technical support and an advanced replacement programme. An online installation video guides the DIY fitting process.
| Brand | OWC |
|---|---|
| Part Number | 1S3D31R802GB |
| Capacity | 2GB |
| Type | 204-Pin DDR3 Non-ECC SODIMM |
| Speed | DDR3 1333 (PC3 10600) |
| CAS Latency | CL9 |
| Voltage | 1.5V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Rank | 1Rx8 |
| Heat Spreader | No |
| Compatible System | HP ProBook 4720s HP ProBook 4730s HP ProBook 4740s HP ProBook 5310m HP ProBook 5320m |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
Power off the laptop, remove the battery, open the memory access panel, insert the module at a 30-degree angle until the gold contacts are hidden, then press down firmly until both side clips click into place. The step many skip is verifying the clips have fully locked on both sides.
No scheduled maintenance is required for the memory itself. Keep the laptop's cooling vents clear of dust so the module stays within its 1.5 V operating envelope. Replacement is only necessary if you need more than 2 GB of capacity or if a module fails.
The 2 GB capacity ceiling is reached before any thermal or timing limit. With only 2 GB available, the system will swap to storage during heavy multitasking long before the DDR3 1333 CL9 module hits its voltage or temperature boundaries.
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