SK hynix HMA42GR7AFR4N-TF 16GB DDR4 2133MHz CL15 ECC Registered Dual Rank 1.2V 288-Pin Server RAM
- 16GB
- 288-Pin DDR4 SDRAM
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SAMSUNG
32 GB DDR4 2400 LRDIMM module with CL17 latency and 1.20 V operation for high-capacity server deployments
This module delivers 32 GB of DDR4 2400 memory in a 288-pin load-reduced form factor. It targets data centres and high-performance computing clusters that need maximum capacity per slot. The 1.20 V operating voltage and CL17 latency suit enterprise workloads where density matters more than raw frequency. Builders expanding virtualised hosts or cloud nodes will fit this part.
The onboard buffer chip replaces the standard register, allowing four ranks (4Rx4) on a single stick without exceeding the memory controller's electrical load limit. This design lets a server populate more slots at full speed, raising total system capacity. The module ships without a heat spreader, relying on chassis airflow. Mixing with RDIMM, ECC UDIMM or standard UDIMM is not supported.
The single specification that decides fitment is the load-reduced DIMM protocol; the system must explicitly support LR-DIMM or the module will not post. No other DDR4 form factor — registered, unbuffered or ECC unbuffered — can be combined with this stick. Verify the platform's qualified-vendor list before ordering.
| Brand | SAMSUNG |
|---|---|
| Model | M386A4G40DM1-CRC |
| Capacity | 32GB |
| Type | 288-Pin DDR4 SDRAM |
| Speed | DDR4 2400 (PC4 19200) |
| CAS Latency | CL17 |
| Voltage | 1.20V |
| Buffered/Registered | Load Reduced |
| Rank | 4Rx4 |
| Heat Spreader | No |
| Shipping weight | 0.11 kg |
| Package size | 171 × 53 × 6 mm |
The module ships without a heat spreader; server chassis airflow typically handles the 1.20V DDR4 2400 thermals, so no retrofit is required.
Each module delivers 32GB via four ranks; the platform’s maximum rank-per-channel limit is reached before the 2400 MT/s signal integrity becomes the bottleneck.
At 1.20V the module runs at standard DDR4 2400 power levels; the load-reduced buffer adds minimal overhead, so heat output stays within typical server DIMM envelopes.
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