SanDisk Optimus GX PRO 8100 1TB M.2 2280 PCIe 5.0 x4 NVMe 2.0 internal SSD SDSP82100TAN-000E0
- Internal Solid Stat…
- M.2 2280-S3-M
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SanDisk
A 4TB internal SSD with PCIe 5.0 x4 interface delivering sequential reads up to 14900 MBps and writes up to 14000 MBps, plus a heatsink
Option 4TB w/ Heatsink
The SanDisk Optimus GX PRO 8100 is a 4TB internal SSD built on 3D NAND TLC with a PCI-Express 5.0 x4 interface and NVMe 2.0 protocol. It targets creators and professionals who need large capacity and high random performance for AI workflows, content creation and demanding gaming libraries. The drive includes an anodized aluminium heatsink with RGB LED.
Under continuous write workloads the drive draws an average active power of 7.0W while reads draw 6.5W, and the low-profile heatsink is designed to maintain thermal headroom during extended sessions. Sequential throughput reaches up to 14900 MBps read and 14000 MBps write, with random performance up to 2,300,000 IOPS read and 2,400,000 IOPS write. Endurance is rated at 2400TB written.
Verify that your motherboard provides an M.2 2280-S3-M slot wired for PCI-Express 5.0 x4 and that the 9.76mm heatsink height fits within your case or motherboard shroud clearance. The operating temperature range spans 0°C to 85°C, so ensure adequate airflow in compact builds. No DRAM cache is present; the controller uses SLC caching for burst acceleration.
| Brand | SanDisk |
|---|---|
| Series | Optimus GX PRO 8100 |
| Model | SDSP82400TAH-000E0 |
| Device Type | Internal Solid State Drive (SSD) |
| Form Factor | M.2 2280-S3-M |
| Capacity | 4TB |
| Memory Components | 3D NAND TLC |
| Interface | PCI-Express 5.0 x4 |
| Protocol | NVMe 2.0 |
| Cache | No DRAM (SLC) |
| Max Sequential Read | Up to 14900 MBps |
| Max Sequential Write | Up to 14000 MBps |
| 4KB Random Read | Up to 2,300,000 IOPS |
| 4KB Random Write | Up to 2,400,000 IOPS |
| Terabytes Written (TBW) | 2400TB |
| MTBF | 1,750,000 hours |
| HeatSink | with HeatSink |
| Power Consumption (Idle) | 5 mW |
| Power Consumption (Active) | Average Active Power Read: 6.5W Average Active Power Write: 7.0W |
| Operating Temperature | 0°C ~ +85°C |
| Storage Temperature | -40°C ~ +85°C |
| Max Shock Resistance | 1,500G @ 0.5 ms half-sine |
| Max Vibration Resistance | Operating Vibration: 5 gRMS, 10-2000 Hz, 3 axes Non-operating Vibration: 4.9 gRMS, 7-800 Hz, 3 axes |
| Height | 9.76mm |
| Width | 25mm |
| Depth | 80mm |
| Weight | 28.2g |
| Shipping weight | 0.45 kg |
| Package size | 127 × 102 × 1 mm |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
Average active power is 6.5W for reads and 7.0W for writes, while idle consumption drops to 5 mW.
It fits a standard M.2 2280 M-key socket wired for PCI-Express 5.0 x4; the S3-M height code means the drive is 9.76 mm tall with the heatsink attached.
Yes, the drive is backward compatible with PCIe 4.0 and 3.0 slots; the 2400 TBW rating and 1,750,000-hour MTBF remain unchanged regardless of link speed.
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