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Green rectangular circuit board with gold edge connector and black chips, M.2 2280 form factor, no heatsink

HUADISK

HUADISK HYV1TBX4(GR) 1TB M.2 2280 PCIe 4.0 x4 NVMe 1.4 3D TLC NAND internal SSD

SKU CH-8Z70-9KCEX MPN HYV1TBX4(GR)

1TB M.2 2280 drive delivers up to 7200 MBps read and 6400 MBps write without a heatsink for tight laptop slots

  • Device TypeInternal Solid State Drive (SSD)
  • Used ForConsumer
  • Form FactorM.2 2280
  • Capacity1TB
  • InterfacePCI-Express 4.0 x4
  • ProtocolNVMe 1.4
  • Up to 7200 MBps sequential read accelerates boot and load times
  • Up to 6400 MBps sequential write speeds large file transfers
  • 720000 IOPS random read keeps multitasking responsive
  • 800000 IOPS random write handles heavy write workloads
  • 600TB written endurance rating supports long-term use

HUADISK 1TB PCIe 4.0 NVMe SSD

The HUADISK HYV1TBX4(GR) is a 1TB M.2 2280 internal solid state drive built for consumer desktops, laptops and PS5 consoles. It uses a PCI-Express 4.0 x4 interface with NVMe 1.4 protocol and 3D TLC NAND. Sequential reads reach up to 7200 MBps and writes up to 6400 MBps, while random performance hits 720,000 IOPS read and 800,000 IOPS write. No heatsink is attached, keeping the module slim for tight clearances.

Thermals noise and power in typical use

Idle power draw is 0.66W and active consumption peaks at 8.18W, so heat output stays modest during everyday workloads. The drive is rated for an operating range of 0°C to 70°C and 5% to 95% humidity, with no moving parts to generate noise. MTBF is specified at 1,000,000 hours and endurance at 600TB written, indicating a design focused on quiet, cool reliability.

Sustained load behaviour without a heatsink

Under prolonged heavy I/O the controller can maintain high throughput until thermal limits are approached, at which point firmware throttles performance to stay within the 70°C ceiling. Because the module ships without a heatsink, sustained write runs in poorly ventilated chassis will hit that limit sooner than on drives with integrated cooling. The 600TB TBW rating and 1,000,000 hour MTBF reflect the NAND and controller durability when thermals are managed.

Najważniejsze cechy

  • Up to 7200 MBps sequential read accelerates boot and load times
  • Up to 6400 MBps sequential write speeds large file transfers
  • 720000 IOPS random read keeps multitasking responsive
  • 800000 IOPS random write handles heavy write workloads
  • 600TB written endurance rating supports long-term use

Specyfikacja

BrandHUADISK
Device TypeInternal Solid State Drive (SSD)
Used ForConsumer
Form FactorM.2 2280
Capacity1TB
InterfacePCI-Express 4.0 x4
ProtocolNVMe 1.4
Max Sequential ReadUp to 7200 MBps
Max Sequential WriteUp to 6400 MBps
4KB Random ReadUp to 720,000 IOPS
4KB Random WriteUp to 800,000 IOPS
Terabytes Written (TBW)600TB
MTBF1,000,000 hours
HeatSinkwithout HeatSink
Power Consumption (Idle)0.66W
Power Consumption (Active)8.18W
Operating Temperature0°C ~ +70°C
Storage Temperature-20°C ~ +75°C
Operating Humidity5-95%
Height80.0mm
Width22.0mm
Depth2.10mm
Weight30g
Waga przesyłki0.05 kg
Wymiary opakowania102 × 64 × 15 mm

Pytania dotyczące tego produktu

How do I install the HUADISK HYV1TBX4(GR) M.2 2280 drive, and what step is often missed?

Insert the drive at an angle into the PCIe 4.0 x4 M.2 slot, press it flat, and secure it with the motherboard screw; the step often missed is tightening that screw, which keeps the NVMe 1.4 SSD from lifting and losing contact.

What maintenance or replacement will the HUADISK HYV1TBX4(GR) need later?

No routine maintenance is required; the 3D TLC NAND is rated for 600TB TBW and 1,000,000 hours MTBF, so replacement is only needed if the drive exceeds its write endurance or fails after the three-year warranty period.

What limit appears first on the HUADISK HYV1TBX4(GR) during sustained heavy writes?

The controller will throttle speeds once the drive temperature approaches the 70°C operating ceiling, because the model ships without a heatsink and active power draw reaches 8.18W under load.

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