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Rectangular grey thermal pad, 85 by 45 by .5 mm

Lirealar

Lirealar Thermal Pad 12.8 W/mK 85x45x0.5mm

SKU CH-BM62-6XNZD

High-conductivity 12.8 W/mK thermal pad measuring 85 by 45 by 0.5 mm, non-conductive and reusable for laptop heatsinks, CPU or GPU coolers

  • Thermal Conductivity12.8 W/mK

Size 85x45x1.0mm

Przekreślone wersje istnieją, ale nie są dostępne w tym miejscu.

  • High thermal conductivity of 12.8 W/mK moves heat efficiently from GPU or CPU
  • Electrically non-conductive silicone prevents short circuits on exposed components
  • Non-corrosive and non-curing material stays effective without hardening over time
  • Natural tackiness allows easy placement and clean removal for rework
  • Single 85x45x0.5mm pad suits laptops, graphics cards, CPUs and LED coolers

What this thermal pad does

The Lirealar thermal pad measures 85 by 45 by 0.5 millimetres and provides a thermal conductivity of 12.8 W/mK. It is a non-conductive silicone pad designed to transfer heat from components such as laptop heatsinks, GPUs, CPUs or LED coolers. The material is non-corrosive, non-curing and non-toxic. Its natural viscosity makes it easy to position and reusable during assembly.

Limits of the pad format

A thermal pad only works well when the mating surfaces are flat and the gap matches the 0.5 millimetre thickness. Uneven pressure or larger gaps reduce contact and raise thermal resistance. The pad cannot flow like paste to fill microscopic voids, so it is unsuitable for surfaces with significant warpage or stepped heights. Electrical insulation is maintained, but mechanical compression must stay within the material’s elastic range.

Installing and common issues

Peel the protective film, align the pad on the clean component, and press the heatsink down evenly. The natural tack holds it in place without adhesive. The most frequent problem is trapping air bubbles or misaligning the pad, which creates hot spots. Reusing a pad that has been compressed for a long time can also lose thickness and conductivity. Clean both surfaces with isopropyl alcohol before each installation.

Najważniejsze cechy

  • High thermal conductivity of 12.8 W/mK moves heat efficiently from GPU or CPU
  • Electrically non-conductive silicone prevents short circuits on exposed components
  • Non-corrosive and non-curing material stays effective without hardening over time
  • Natural tackiness allows easy placement and clean removal for rework
  • Single 85x45x0.5mm pad suits laptops, graphics cards, CPUs and LED coolers

Specyfikacja

Thermal Conductivity12.8 W/mK

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

Ta sama rodzina, inna pamięć, inne chłodzenie lub taktowanie — proszę porównać przed decyzją.

Pytania dotyczące tego produktu

Should I choose the 85x45x0.5 mm pad or a different thickness for my laptop GPU?

The 0.5 mm thickness suits gaps around 0.5 mm; if your heatsink-to-die gap is larger you need a thicker pad, if smaller a thinner one.

What does 12.8 W/mK actually deliver once the pad is installed?

It conducts heat 12.8 watts per metre-kelvin across the 85x45 mm area, lowering junction temperature proportionally to the pressure and surface flatness.

Is the pad electrically conductive or does it insulate the components?

It is non-electrically conductive and insulated, so it will not short GPU, CPU or LED circuitry while transferring heat.

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