Lirealar Extreme Odyssey Thermal Pad 12.8 W/mK 85x45x2.5mm
- 12.8 W/mK
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Lirealar
High-conductivity 12.8 W/mK thermal pad measuring 85 by 45 by 0.5 mm, non-conductive and reusable for laptop heatsinks, CPU or GPU coolers
Size 85x45x1.0mm
Struck-through versions exist but are not stocked here.
The Lirealar thermal pad measures 85 by 45 by 0.5 millimetres and provides a thermal conductivity of 12.8 W/mK. It is a non-conductive silicone pad designed to transfer heat from components such as laptop heatsinks, GPUs, CPUs or LED coolers. The material is non-corrosive, non-curing and non-toxic. Its natural viscosity makes it easy to position and reusable during assembly.
A thermal pad only works well when the mating surfaces are flat and the gap matches the 0.5 millimetre thickness. Uneven pressure or larger gaps reduce contact and raise thermal resistance. The pad cannot flow like paste to fill microscopic voids, so it is unsuitable for surfaces with significant warpage or stepped heights. Electrical insulation is maintained, but mechanical compression must stay within the material’s elastic range.
Peel the protective film, align the pad on the clean component, and press the heatsink down evenly. The natural tack holds it in place without adhesive. The most frequent problem is trapping air bubbles or misaligning the pad, which creates hot spots. Reusing a pad that has been compressed for a long time can also lose thickness and conductivity. Clean both surfaces with isopropyl alcohol before each installation.
| Thermal Conductivity | 12.8 W/mK |
|---|
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
The 0.5 mm thickness suits gaps around 0.5 mm; if your heatsink-to-die gap is larger you need a thicker pad, if smaller a thinner one.
It conducts heat 12.8 watts per metre-kelvin across the 85x45 mm area, lowering junction temperature proportionally to the pressure and surface flatness.
It is non-electrically conductive and insulated, so it will not short GPU, CPU or LED circuitry while transferring heat.
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