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NEMIX RAM

NEMIX RAM DDR4 32GB 2x16GB 3200MHz CL22 SODIMM memory upgrade for Supermicro X12STN

SKU CH-VK2K-801JB

32 GB dual-channel DDR4-3200 SODIMM kit with CL22 timing and 1.2 V operation, validated for Supermicro X12STN motherboards

  • Capacity32GB (2 x 16GB)
  • Type260-Pin DDR4 SODIMM
  • SpeedDDR4 3200 (PC4 25600)
  • CAS LatencyCL22
  • Voltage1.20V
  • ECCNo

Size 32GB 2X16GB

  • Exact-match 32 GB kit runs at DDR4-3200 CL22 1.2 V for full-rated speed
  • Verified fit for Supermicro X12STN series using 260-pin SODIMM form factor
  • Built with major OEM Samsung Micron Hynix chips tested for stability
  • Dual-rank 1Rx8 organisation matches controller expectations for reliable operation
  • Lifetime replacement warranty with free US-based technical support included

System-specific DDR4 SODIMM kit

This 32GB kit contains two 16GB DDR4-3200 modules built to the exact rank, voltage and timing the Supermicro X12STN memory controller expects. Each stick is a 260-pin unbuffered SODIMM rated at CL22 and 1.2V, using major OEM chips from Samsung, Micron or Hynix. The kit targets administrators and technicians who need a verified, drop-in capacity increase for this specific platform.

Thermals noise and power draw

Operating at the standard 1.2V DDR4 voltage, the modules draw minimal power and produce negligible heat during typical workloads. No heat spreader is fitted, so the bare DRAM packages rely on normal chassis airflow, which is sufficient for everyday server or workstation duties. Silent operation is assured because the memory has no moving parts and adds no audible noise to the system.

Sustained load behaviour

The CL22 timing and 1Rx8 organisation remain stable at the rated 3200 MT/s during extended compute tasks such as virtualisation, compilation or database work. Major-brand DRAM and factory validation at speed, voltage and latency reduce the risk of errors when the memory subsystem runs continuously at full throughput. The kit delivers consistent bandwidth for long-running workloads without throttling or instability.

Najważniejsze cechy

  • Exact-match 32 GB kit runs at DDR4-3200 CL22 1.2 V for full-rated speed
  • Verified fit for Supermicro X12STN series using 260-pin SODIMM form factor
  • Built with major OEM Samsung Micron Hynix chips tested for stability
  • Dual-rank 1Rx8 organisation matches controller expectations for reliable operation
  • Lifetime replacement warranty with free US-based technical support included

Specyfikacja

BrandNEMIX RAM
SeriesNEMIX RAM Original Series Memory
ModelDDR4 Non-ECC Unbuffered SODIMM Memory
Part NumberMS25600-618K2
Capacity32GB (2 x 16GB)
Type260-Pin DDR4 SODIMM
SpeedDDR4 3200 (PC4 25600)
CAS LatencyCL22
Voltage1.20V
ECCNo
Buffered/RegisteredUnbuffered
Rank1Rx8
ChipsetMajor OEM Samsung, Micron, Hynix
Heat SpreaderNo
Compatible SystemSupermicro
FeaturesDDR4 Non-ECC Unbuffered SODIMM Motherboard Compatible
Package Content32GB 2X16GB DDR4 3200MHz PC4-25600 1Rx8 1.2V 260-PIN Non-ECC SODIMM KIT

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

Ta sama rodzina, inna pamięć, inne chłodzenie lub taktowanie — proszę porównać przed decyzją.

Pytania dotyczące tego produktu

How do I install the 260-pin DDR4 SODIMM modules in my Supermicro X12STN, and what step is often missed?

Power off the system, open the chassis, align each 260-pin SODIMM with the slot key, insert at an angle, then press down firmly until both side clips click — the step most people miss is verifying both clips are fully latched.

What maintenance or replacement will this 32GB DDR4 kit need over time?

No scheduled maintenance is required; the modules have no heat spreader or moving parts, so replacement is only needed if a module fails or you later upgrade capacity beyond 32GB.

What limit appears first when the 3200MHz CL22 1.2V memory runs under sustained load?

The CAS latency of 22 cycles at 3200MHz sets the timing ceiling; under continuous heavy workloads the memory controller will hit this latency boundary before voltage or thermal limits become a factor.

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