EN-Labs 11-001-366 PCIe x4 USB 3.2 10Gbps 5-port card
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- 12CM Case fan,screw…
AMD
24-core server processor with 48 threads, 2.3 GHz base clock, 3.2 GHz max turbo, 128 MB L3 cache, 8-channel DDR4-3200 support, 128 PCIe 4.0 lanes, 155 W TDP, Socket SP3, 7 nm process
The AMD EPYC 7352 is a 24-core server CPU designed for data-centre workloads that demand high thread counts. It delivers 48 threads at a 2.3 GHz base frequency with a 3.2 GHz max turbo boost. The 155W TDP suits dense rack deployments where power envelopes are tightly managed.
Eight DDR4-3200 channels provide substantial bandwidth but cap memory speed at 3200 MT/s. The 128 PCIe 4.0 lanes support extensive storage and networking, yet the 4.0 revision prevents use of newer 5.0 devices at full rate. Builders needing more than 128 lanes must choose a different platform.
The SP3 socket accepts the processor without soldering, but the OEM pack omits a cooling solution. A compatible SP3 cooler rated for 155W must be sourced separately. Incorrect mounting pressure or an undersized heatsink are the most common causes of thermal throttling during bring-up.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7002 |
| Name | EPYC 7352 |
| Model | 100-000000077 |
| CPU Socket Type | Socket SP3 |
| # of Cores | 24-Core |
| # of Threads | 48 |
| Operating Frequency | 2.3 GHz |
| Max Turbo Frequency | 3.2 GHz |
| L3 Cache | 128MB |
| 64-Bit Support | Yes |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 155W |
| Cooling Device | Cooling device not included - Processor Only |
| 出貨重量 | 1.97 kg |
| 包裝尺寸 | 203 × 127 × 76 mm |
The EPYC 7352 delivers 24 cores and 48 threads at a 2.3 GHz base clock with a 3.2 GHz max turbo, suited for balanced compute density.
It guarantees 2.3 GHz across all 24 cores under sustained load within the 155 W TDP, while the 3.2 GHz turbo activates when thermal headroom allows.
PCIe 4.0 provides 128 lanes from the processor itself, enabling direct attachment of high-bandwidth devices such as GPUs or storage controllers without a chipset bottleneck.
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