ASUS PRIME B860M-K Intel motherboard & Ultra 5 245K CPU combo with Shin-Etsu X-23-7868-2D thermal grease
- LGA 1851
ASUS
A motherboard and CPU bundle with thermal paste, featuring an LGA 1851 board, Intel Ultra 5 245K processor, DDR5 memory support and 2.5G wired networking
model EX-B860M-V5/SI
+CPU +Ultra 5 245K
The ASUS EX-B860M-V5/SI motherboard ships paired with an Intel Ultra 5 245K processor and Shin-Etsu X-23-7868-2D thermal grease. The bundle targets internet café operators who need hardware validated for continuous gaming sessions and diskless boot environments.
Shin-Etsu paste with 6.2 W/m.k conductivity and 0.07 °C*cm²/W resistance reduces the risk of uneven coverage during assembly. ASUS iCafé Lab certification confirms the board passes reboot and diskless-system compatibility tests for managed café deployments.
The processor drops into the LGA 1851 socket without a separate cooler in the box, so builders must supply their own mounting hardware. Applying the included gray paste is rated easy, though the 100 Pa.s viscosity demands even pressure to avoid air pockets.
| Brand | ASUS |
|---|---|
| Model | EX-B860M-V5/SI+Ultra 5 245K |
| CPU Socket Type | LGA 1851 |
其他版本
同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。
The manufacturer suggests a replacement cycle of two years, with an official lifespan of three to five years. The paste has a thermal conductivity of 6.2 W/m.k and thermal resistance of 0.07 °C·cm²/W.
The processor has a 125 W base power rating. Under continuous load the CPU will hold to this limit unless the motherboard firmware applies a higher PL2 setting.
The CPU is rated at 125 W base power. A cooler rated for at least that TDP is required; the included Shin-Etsu paste (6.2 W/m.k conductivity, 0.07 °C·cm²/W resistance) helps transfer heat efficiently.
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