EN-Labs 11-001-366 PCIe x4 USB 3.2 10Gbps 5-port card
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Computer Memory Solutions
32 GB kit of four 8 GB DDR4 2400 MHz CL17 unbuffered DIMMs validated for ASUS TUF X299 and WS X299 motherboards
This 32GB kit contains four 8GB DDR4 DIMMs validated for ASUS TUF X299 Mark 1, Mark 2, WS X299 PRO, WS X299 SAGE and WS X299 SAGE/10G motherboards. It targets professionals expanding memory on Intel Core X-series platforms that require matched 288-pin modules. Builders needing registered ECC memory or capacities beyond 64GB on four-core X-series CPUs should look elsewhere.
Operating at 1.2V without heat spreaders, these unbuffered modules rely on case airflow for cooling in typical workstation loads. The CL17 17-17-17 timing at 2400MHz keeps voltage steady during sustained compute tasks. No active cooling or additional power connectors are involved.
Computer Memory Solutions supplies a limited lifetime warranty against manufacturing defects when purchased directly from them. The four sticks are tested together to avoid incompatibility between modules. Packaging may differ from product images.
| Brand | Computer Memory Solutions |
|---|---|
| Model | CM1024642400DIMM |
| Capacity | 32GB (4 x 8GB) |
| Type | 288-Pin DDR4 SDRAM |
| Speed | DDR4 2400 (PC4 19200) |
| CAS Latency | CL17 |
| Timing | 17-17-17 |
| Voltage | 1.2V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Rank | 2Rx8 |
| Chipset | Major Brand Chipset |
| Heat Spreader | No |
| Compatible System | ASUS/ASmobile TUF X299 Mark 1, TUF X299 Mark 2, WS X299 PRO, WS X299 SAGE, WS X299 SAGE/10G Motherboards |
| Package Content | 4 Memory RAM Sticks |
Populate all four modules in the same-coloured slots — usually DDR4_A1, B1, C1, D1 — then enable the 2400 MHz XMP profile in BIOS; the step most builders skip is saving that profile before exiting.
No scheduled maintenance is required; the modules carry a limited lifetime exchange warranty from Computer Memory Solutions against manufacturing defects.
The 1.2 V JEDEC voltage ceiling and CL17 latency bound maximum stable throughput before thermal or timing limits are reached.
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