EN-Labs 11-001-366 PCIe x4 USB 3.2 10Gbps 5-port card
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Intel
Eight-core Xeon server CPU running at 2.9 GHz with 16 threads, 22.5 MB L3 cache and a 4.1 GHz maximum turbo frequency
This Intel Xeon Gold 5415+ processor delivers 8 cores and 16 threads at a base frequency of 2.9 GHz with a maximum turbo of 4.1 GHz. It is built on a 10 nm Sapphire Rapids architecture and fits the LGA 4677 socket with a 150 W thermal design power. The chip suits dual-socket servers needing up to 4 TB of memory across eight channels.
The 22.5 MB L3 cache reduces latency for data-intensive workloads while the integrated memory controller runs at 4400 MHz across eight channels. Eighty PCI Express 5.0 lanes provide high-bandwidth connectivity for accelerators, storage controllers and networking adapters without a separate chipset. Virtualisation technology support is included for hypervisor deployments.
Verify that your motherboard uses the LGA 4677 socket and that its power delivery and BIOS support this processor. Ensure the cooling solution is rated for at least 150 W sustained heat dissipation. Confirm the chassis airflow and power budget can accommodate a dual-socket configuration if a second processor is planned.
| Brand | Intel |
|---|---|
| Series | Intel Xeon Gold |
| Name | Xeon Gold 5415+ |
| Model | PK8071305118701 |
| CPU Socket Type | LGA 4677 |
| Core Name | Sapphire Rapids |
| # of Cores | 8-Core |
| # of Threads | 16 |
| Operating Frequency | 2.9 GHz |
| Max Turbo Frequency | 4.1 GHz |
| L3 Cache | 22.5MB |
| 64-Bit Support | Yes |
| Manufacturing Tech | 10 nm |
| Integrated Memory Controller Speed | 4400 MHz |
| Maximum Memory Capacity | 4TB |
| Memory Channel | 8 Channel |
| Virtualization Technology Support | Yes |
| Scalability | 2S |
| PCI Express Revision | 5.0 |
| Max # of PCI Express Lanes | 80 |
| Thermal Design Power | 150W |
| Cooling Device | Cooling device not included - Processor Only |
| 出貨重量 | 0.23 kg |
| 包裝尺寸 | 191 × 152 × 83 mm |
The processor installs directly into the LGA 4677 socket on the motherboard; the socket itself is part of the board and not a replaceable component on the CPU.
The 150 W thermal design power is the primary constraint; the cooling solution must dissipate that heat continuously to maintain the 2.9 GHz base frequency.
The chip is rated at 150 W, so it will draw that level of power and generate a corresponding amount of heat that the system cooler must handle continuously.
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