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Two black DDR5 modules with silver aluminium heatsinks

KLEVV

KLEVV KD58GU880-60A300L 16GB DDR5 6000 CL30 desktop RAM

SKU CH-0RM2-C97AP MPN KD58GU880-60A300L

16 GB dual-channel DDR5 kit at 6000 MT/s with CL30 latency and 1.35 V for AMD Ryzen and Intel platforms

  • Capacity16GB (2 x 8GB)
  • SpeedDDR5 6000 (PC5 48000)
  • CAS LatencyCL30
  • Timing30-36-36-76
  • Voltage1.35V
  • Multi-channel KitDual Channel Kit

Capacity

  • 16GB x 2
  • 32GB x 2
  • 8GB x 2

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Speed DDR5 6000

Color Black C30

  • Dual-channel 16 GB kit enables high-throughput multitasking
  • DDR5 6000 speed with CL30 latency cuts response time
  • 35 V operation reduces power draw and heat
  • Low-profile black heatsinks clear large CPU coolers
  • Intel XMP 3.0 and AMD EXPO profiles simplify stable overclocking

16GB dual-channel DDR5 kit

This 16 GB kit contains two 8 GB DDR5 modules rated at 6000 MT/s with CL30 latency and 30-36-36-76 timings. It runs at 1.35 V and includes both Intel XMP 3.0 and AMD EXPO profiles for one-click configuration. The black aluminium heatspreader keeps the modules cool under sustained loads.

Suits AMD and Intel desktop builds needing 16 GB

Builders targeting AMD 500, 600 or 800 series chipsets or Intel platforms with XMP 3.0 support can enable the rated speed immediately. Systems limited to lower DDR5 speeds or those requiring ECC registered memory should choose a different kit.

6000 MT/s CL30 at 1.35 V

The combination of 6000 MT/s transfer rate, CL30 CAS latency and 1.35 V operating voltage determines whether this kit matches your motherboard's qualified vendor list and your performance targets.

商品特色

  • Dual-channel 16 GB kit enables high-throughput multitasking
  • DDR5 6000 speed with CL30 latency cuts response time
  • 35 V operation reduces power draw and heat
  • Low-profile black heatsinks clear large CPU coolers
  • Intel XMP 3.0 and AMD EXPO profiles simplify stable overclocking

商品規格

BrandKlevv
ModelKD58GU880-60A300L
Capacity16GB (2 x 8GB)
SpeedDDR5 6000 (PC5 48000)
CAS LatencyCL30
Timing30-36-36-76
Voltage1.35V
Multi-channel KitDual Channel Kit
BIOS/Performance ProfileAMD EXPO / Intel XMP 3.0 / Intel XMP 3.0 and AMD EXPO
ColorBlack
Recommend UseAMD & Intel Compatible / AMD 500 Series / AMD 600 Series / AMD 800 Series / AMD A520 / AMD B550 / AMD B650 / AMD B850 / AMD Ryzen Compatible / AMD WRX90 / AMD X570 / AMD X670 / AMD X870 / High Performance or Gaming Memory / Intel 500 Series / Intel 600 Series / Intel 700 Series / Intel 800 Series / Intel B560 / Intel B660 / Intel B670 / Intel B760 / Intel Compatible / Intel H770 / Intel Z590 / Intel Z690 / Intel Z790 / Intel Z890
LED ColorNone
出貨重量0.09 kg
包裝尺寸191 × 146 × 9 mm

其他版本

同系列還有 5 款

同系列產品，記憶體、散熱器或時脈不同 — 下單前請先比較。

商品問答

Will this 16 GB kit fit under a large CPU cooler?

The ultra low-profile design and 36 mm height leave ample clearance for most tower coolers.

Do I need to enable a profile in BIOS to reach the rated speed?

Yes, select the Intel XMP 3.0 or AMD EXPO profile in BIOS to run at 6000 MT/s with CL30 timings.

Is the memory compatible with both AMD 600-series and Intel 600-series platforms?

The kit carries both AMD EXPO and Intel XMP 3.0 certifications and is validated on AMD B650, X670 and equivalent Intel chipsets.

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