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Two white low-profile DDR5 memory modules side by side

KLEVV

KLEVV KD58GU880-60A300F 16GB (2x8GB) DDR5 6000 CL30 desktop RAM

SKU CH-9N8A-XMJTV MPN KD58GU880-60A300F

16 GB dual-channel DDR5 kit at 6000 MT/s with CL30 timing and 1.35 V for high-performance desktop builds

  • Capacity16GB (2 x 8GB)
  • SpeedDDR5 6000 (PC5 48000)
  • CAS LatencyCL30
  • Timing30-36-36-76
  • Voltage1.35V
  • Multi-channel KitDual Channel Kit

Capacity

  • 16GB x 2
  • 32GB x 2
  • 8GB x 2

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Speed DDR5 6000

Color Gray C30

  • Dual-channel 16 GB kit enables smooth multitasking
  • DDR5 6000 with CL30 latency delivers responsive performance
  • Low 1.35 V voltage reduces power draw
  • Silver aluminium heatsinks keep modules cool under load
  • Ultra low-profile design fits large CPU coolers

Kit capacity and audience

This 16GB dual-channel kit delivers DDR5 6000 speed with CL30 latency for desktop builders targeting AMD Ryzen and Intel platforms. White aluminum heatsinks keep the profile low so large air coolers fit without interference.

Sustained-load behaviour

On-die ECC and a dedicated PMIC maintain data integrity and stable voltage during long rendering or compilation sessions. The 1.35V operating point and 30-36-36-76 timings are designed to hold rated frequency without thermal throttling.

Build and daily use

Silver heatsinks use selected ICs without mixing memory IDM to ensure consistent quality across both modules. Intel XMP 3.0 and AMD EXPO profiles load automatically in BIOS for immediate operation at rated speed.

商品特色

  • Dual-channel 16 GB kit enables smooth multitasking
  • DDR5 6000 with CL30 latency delivers responsive performance
  • Low 1.35 V voltage reduces power draw
  • Silver aluminium heatsinks keep modules cool under load
  • Ultra low-profile design fits large CPU coolers

商品規格

BrandKlevv
ModelKD58GU880-60A300F
Capacity16GB (2 x 8GB)
SpeedDDR5 6000 (PC5 48000)
CAS LatencyCL30
Timing30-36-36-76
Voltage1.35V
Multi-channel KitDual Channel Kit
BIOS/Performance ProfileAMD EXPO / Intel XMP 3.0 / Intel XMP 3.0 and AMD EXPO
ColorWhite
Recommend UseAMD & Intel Compatible / AMD 500 Series / AMD 600 Series / AMD 800 Series / AMD A520 / AMD B550 / AMD B650 / AMD B850 / AMD Ryzen Compatible / AMD WRX90 / AMD X570 / AMD X670 / AMD X870 / High Performance or Gaming Memory / Intel 500 Series / Intel 600 Series / Intel 700 Series / Intel 800 Series / Intel B560 / Intel B660 / Intel B670 / Intel B760 / Intel Compatible / Intel H770 / Intel Z590 / Intel Z690 / Intel Z790 / Intel Z890
LED ColorNone
出貨重量0.09 kg
包裝尺寸191 × 146 × 6 mm

其他版本

同系列還有 5 款

同系列產品，記憶體、散熱器或時脈不同 — 下單前請先比較。

商品問答

How much power does the 1.35 V kit draw when running at DDR5 6000 CL30 all day?

The modules operate at 1.35 V with on-die ECC and a PMIC for efficient power delivery, while silver aluminum heatsinks provide maximum cooling during sustained workloads.

What motherboard slot and firmware profile are required to run this dual-channel kit at its rated speed?

The kit needs a DDR5 DIMM slot and a BIOS that can load Intel XMP 3.0 or AMD EXPO profiles; the motherboard QVL lists this part as approved.

Can the white ultra-low-profile sticks sit under a large air cooler on an older DDR5 board?

Yes, the ultra-low-profile design clears oversized CPU coolers, and the kit is QVL approved for mainstream DDR5 motherboards including 500, 600 and 800 series chipsets.

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