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Micron

Micron MTFDKCC7T6TFR-1BC15ABYYR 7450 PRO enterprise SSD 7.68 TB

SKU CH-877D-30EPN MPN MTFDKCC7T6TFR-1BC15ABYYR

U.3 PCIe 4.0 NVMe enterprise SSD with 7.68 TB capacity and 176-layer NAND

  • Enterprise workloads accelerate with PCIe 4.0 NVMe speed
  • Consistent 2 ms latency at 99.9999% QoS for responsive data centers
  • 176-layer NAND delivers 7.68 TB high-capacity storage
  • OCP NVMe SSD 2.0 support enables rapid issue resolution
  • U.3 22 x 80 mm form factor with power-loss protection for server boot

Capacity & interface

The Micron 7450 PRO enterprise SSD delivers 7.68 TB of storage over a PCIe 4.0 NVMe interface. It uses a U.3 form factor measuring 22 x 80 mm and is built on 176-layer NAND technology. The drive targets cloud-scale and enterprise data centres that need high-capacity, low-latency storage.

Boot & OCP focus

This model is specifically designed for server boot use and includes power-loss protection. It supports OCP NVMe SSD 2.0 for intelligent management and rapid issue resolution. The jump is worthwhile when replacing drives that lack standardised management or consistent quality-of-service guarantees.

Latency headroom

The SSD consistently delivers 2 ms and lower latency for 99.9999% QoS across varied workloads. A unique secure execution environment adds hardware-level protection. It is not suited for buyers who need a different physical connector or a drive without power-loss protection for boot tasks.

商品特色

  • Enterprise workloads accelerate with PCIe 4.0 NVMe speed
  • Consistent 2 ms latency at 99.9999% QoS for responsive data centers
  • 176-layer NAND delivers 7.68 TB high-capacity storage
  • OCP NVMe SSD 2.0 support enables rapid issue resolution
  • U.3 22 x 80 mm form factor with power-loss protection for server boot

商品規格

本商品目前尚未公佈規格。

商品問答

Will the 22 x 80 mm M.2 form factor fit my server's U.3 bay?

The drive uses the M.2 22 x 80 mm footprint with a U.3 PCIe 4.0 NVMe interface; verify your chassis accepts that exact module size before purchase.

What is the most common installation mistake with the U.3 connector?

Inserting the module at an angle instead of straight into the U.3 backplane can bend the PCIe 4.0 signal pins and prevent the drive from being detected.

When should I plan to replace the 176-layer NAND drive?

Track the Media and Data Integrity SMART log; when the percentage-used field reaches the vendor-defined threshold the 7.68 TB unit should be swapped.

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