BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
NEMIX RAM
8GB DDR3 1333 SODIMM module for POSIFLEX KS-7417Z point-of-sale terminals
This 204-pin DDR3 module delivers 8 GB at 1333 MHz for the POSIFLEX KS-7417Z fanless POS terminal. It uses a 2Rx8 unbuffered layout and runs at 1.35 V. The part number is MS10600-828K1. It is built with major OEM chips from Samsung, Micron or Hynix.
The 1.35 V rating keeps power draw and heat low, which suits the fanless chassis of the target terminal. No heat spreader is fitted, so the module relies on the system airflow design. CL9 latency at PC3-10600 speed provides stable timing for continuous point-of-sale workloads.
Upgrading from a 2 GB or 4 GB stick to this 8 GB module adds headroom for multi-tasking POS software. The jump is worth it when the terminal runs several peripherals or a local database. It will not fit systems that require DDR5, ECC, registered DIMMs or a different pin count.
| Brand | NEMIX RAM |
|---|---|
| Series | POSIFLEX POS Series Point of Sale Kiosk Memory |
| Model | POSIFLEX POS DDR3 1333MHZ Non-ECC Unbuffered SODIMM |
| Part Number | MS10600-828K1 |
| Capacity | 8GB |
| Speed | DDR3 1333 (PC3 10600) |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Voltage | 1.50V |
| Compatible System | POSIFLEX POS |
| CAS Latency | CL9 |
| Heat Spreader | No |
| Type | 204-Pin DDR3 SODIMM |
| Rank | 2Rx8 |
| Features | DDR3 Non-ECC Unbuffered SODIMM Motherboard Compatible |
| Package Content | 8GB (1X8GB) DDR3 1333MHZ PC3-10600 2Rx8 1.35V 204-PIN Non-ECC Unbuffered SODIMM |
Power off the terminal, open the memory compartment, align the notch on the 204-pin SODIMM with the slot key, press firmly until the side clips click, then verify 8GB appears in BIOS before closing the case.
No scheduled maintenance is required; the module has no heat spreader and runs at 1.35V, so replacement is only necessary if a memory test reports errors or the terminal fails to POST.
The DDR3 1333 MT/s bandwidth and CL9 latency ceiling will bottleneck throughput before the 1.50 V JEDEC voltage limit or thermal constraints become a factor.
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