OWC 8GB DDR3L 1866 CL13 2Rx8 204-pin 1.35V Non-ECC SODIMM memory upgrade
- 8GB
- 204-Pin DDR3L Non-E…
OWC
8GB DDR3 1600 CL11 SODIMM upgrades the HP 6300 Pro AIO with 204-pin 1.5V non-ECC memory
This OWC module delivers 8 GB of DDR3 1600 memory in a 204-pin SODIMM form factor. It is built to JEDEC and RoHS standards and tested for the HP 6300 Pro AIO. The stick runs at 1.5 V with CL11 latency and a 2Rx8 rank configuration. No heat spreader is fitted.
The module suits anyone upgrading the named all-in-one desktop with a single 8 GB stick. Buyers whose systems demand ECC registered memory, a different pin count, or a voltage other than 1.5 V should look elsewhere. The part is unbuffered and non-ECC by design.
The 204-pin DDR3 SODIMM interface is the single specification that decides fitment. Only platforms accepting this exact physical and electrical standard will accept the module. Verify the slot type before purchase.
| Brand | OWC |
|---|---|
| Part Number | 1S6D32R808GB |
| Capacity | 8GB |
| Type | 204-Pin DDR3 Non-ECC SODIMM |
| Speed | DDR3 1600 (PC3 12800) |
| CAS Latency | CL11 |
| Voltage | 1.5V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Rank | 2Rx8 |
| Heat Spreader | No |
| Compatible System | HP 6300 Pro AIO |
其他版本
同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。
DDR3 memory has no moving parts and is designed to last the system's lifetime; replacement is only needed if a fault occurs.
The CL11 latency at 1600MHz sets the access speed ceiling; thermal throttling is unlikely without a heat spreader in this AIO chassis.
At 1.5V the module draws minimal power and produces low heat; the unbuffered 2Rx8 design runs cool inside the 6300 Pro AIO.
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