EN-Labs 11-001-366 PCIe x4 USB 3.2 10Gbps 5-port card
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SAMSUNG
2GB DDR2 667 ECC fully buffered DIMM with CL5 latency for server memory upgrades
This module is a 2 GB DDR2 SDRAM DIMM rated at 667 MHz (PC2 5300) with ECC and fully buffered signalling. It uses a 240-pin interface, runs at 1.80 V and carries a CAS latency of CL5. The dual-rank 2Rx4 organisation suits servers that require chip-level error correction and the FB-DIMM protocol.
It fits systems built for DDR2 fully buffered memory where ECC is mandatory and the memory controller expects the advanced memory buffer protocol. It will not work in platforms that accept only unbuffered or registered DDR2 DIMMs, nor in any board designed for later DDR generations. Buyers needing higher densities or faster speeds must select a different module family.
The defining specification is the fully buffered architecture combined with ECC on a 240-pin DDR2 667 DIMM. Only motherboards that explicitly support FB-DIMM technology can use this module; all other DDR2 form factors are electrically incompatible.
| Brand | SAMSUNG |
|---|---|
| Model | M395T5750EZ4-CE65 |
| Capacity | 2GB |
| Type | 240-Pin DDR2 SDRAM |
| Speed | DDR2 667 (PC2 5300) |
| CAS Latency | CL5 |
| Voltage | 1.80V |
| ECC | Yes |
| Buffered/Registered | Fully Buffered |
| Rank | 2Rx4 |
Only the 240-pin DDR2 667 ECC Fully Buffered module is supplied; no brackets, cables or thermal pads are included.
The part number M395T5750EZ4-CE65 identifies a single 2GB 2Rx4 configuration; no other capacities or ranks share this model.
The module runs at 667 MHz with CL5 latency at 1.80V, providing ECC Fully Buffered operation for compatible DDR2 server platforms.
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