Thermal Grizzly
Thermal Grizzly Minus Pad 8 120x20x2.0mm TG-MP8-1202020-1R thermal paste
A 120x20mm thermal pad with 8.0 W/mK conductivity and 2.0mm thickness for efficient heat transfer between components and heatsinks
- 0 W/mK conductivity moves heat fast from chip to cooler
- 120 mm by 20 mm sheet covers large VRM or GPU areas
- 0 mm thickness bridges uneven gaps without extra pressure
- Operates from -100 °C to 250 °C for extreme cooling setups
Thermal Pad 8.0 W/mK Conductivity
The Thermal Grizzly Minus Pad 8 delivers 8.0 W/mK thermal conductivity in a light brown pad measuring 120 by 20 millimetres with a 2.0 millimetre thickness. It suits builders who need a pre-cut interface for memory modules or voltage regulators. Buyers requiring larger sheets or custom shapes will need a different format.
Operating Range -100°C to +250°C
The pad remains stable across a continuous operating window from minus 100 degrees Celsius to plus 250 degrees Celsius. Its compliant structure fills microscopic gaps without pump-out or dry-out, keeping thermal resistance low and fan noise unchanged. No curing time or re-application is required during normal use.
商品特色
- 0 W/mK conductivity moves heat fast from chip to cooler
- 120 mm by 20 mm sheet covers large VRM or GPU areas
- 0 mm thickness bridges uneven gaps without extra pressure
- Operates from -100 °C to 250 °C for extreme cooling setups
商品規格
本商品目前尚未公佈規格。
商品問答
How do I install the 120x20x2.0mm Minus Pad 8, and what step do people often get wrong?
Cut the pad to size, peel both protective films, and place it on the component without stretching; the common mistake is leaving one film on, which blocks heat transfer.
Will the Minus Pad 8 with 8.0 W/mK conductivity need replacement, and how can I tell?
It does not dry out like paste, but inspect it during upgrades; replace if the light-brown material shows permanent compression, cracking, or reduced thickness from the original 2.0 mm.
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