Timetec 64GB Kit (4×16GB) DDR4 2400 CL17 1.2V 260-Pin SODIMM Laptop RAM
- 64GB (4 x 16GB)
- 260-Pin DDR4 SO-DIMM
Timetec
Four 16 GB DDR4 modules run at 3200 MHz with CL16 latency and a white aluminium heat spreader
Capacity 64GB (4 x 16GB)
This kit provides 64 GB of DDR4 memory across four 16 GB modules rated for 3200 MHz operation. White aluminum heat spreaders cover each stick for a consistent look inside a gaming or enthusiast build. XMP 2.0 support allows the rated speed and timings to be applied with a single BIOS setting on compatible AMD and Intel DDR4 motherboards. Without XMP enabled the modules will run at the standard 2400 MHz base frequency.
The modules operate at 1.35 V using a high-conductivity thermal pad and reinforced heatsink to move heat away from the memory ICs. Lower voltage reduces power draw compared to higher-voltage DDR4 kits while still delivering the rated 3200 MHz data rate. Passive cooling means no fan noise is added to the system. The aluminum spreader design keeps temperatures in check during typical gaming and multitasking workloads.
Tested latencies of 16-18-18-38 and 16-20-20-40 are maintained once XMP 2.0 is active in the BIOS. Each IC is individually screened to support stable operation at the advertised frequency during extended sessions. Dual-rank 1Rx8 organisation on the 16 GB modules helps sustain bandwidth under continuous memory-intensive tasks. The kit delivers 25 600 MB/s peak bandwidth without requiring active airflow directed at the memory slots.
| Capacity | 64GB (4 x 16GB) |
|---|---|
| Speed | DDR4 3200 (PC4 25600) |
| Color | White |
其他版本
同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。
Insert each 288-pin module into the motherboard slots until the latches click, then enable the XMP 2.0 profile in BIOS so the kit runs at 3200 MHz instead of the 2400 MHz default.
The heat spreader and thermal pad are passive; no scheduled replacement is required. Clean dust from the fins with compressed air if temperatures rise.
The CAS latency of CL16-18-18-38 (or CL16-20-20-40) sets the timing floor; thermal throttling may occur if case airflow cannot dissipate heat from the four modules.
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