NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
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Computer Memory Solutions
Four-module 16 GB DDR2 667 MHz ECC registered kit for HP ProLiant DL185 G5 servers
This 16GB kit contains four 4GB DDR2-667 registered ECC DIMMs built for the HP ProLiant DL185 G5 server. Each module runs at 1.8V with CL5 timing and a 2Rx4 organisation. The registered buffer and error-correcting code suit multi-socket workloads that demand data integrity.
Registered signalling reduces electrical loading on the memory bus, allowing all eight sockets to be populated without timing degradation. ECC corrects single-bit errors on the fly, preventing silent data corruption during long compute runs. Dual-rank 2Rx4 chips enable four-way bank interleaving when four DIMMs are installed per processor node.
The kit expands a DL185 G5 toward its 64GB maximum across eight slots. Install kits in decreasing capacity order, placing the largest modules in the banks furthest from each CPU. Mixing single and dual-rank DIMMs on the same node disables bank interleaving, so match ranks within each processor. Only Opteron models 2378, 2382 or 2384 support DDR2-800; otherwise the system clocks to 667MHz.
| Brand | Computer Memory Solutions |
|---|---|
| Model | CM512725300ECCREG2R4 |
| Capacity | 16GB (4 x 4GB) |
| Type | 240-Pin DDR2 SDRAM |
| Speed | DDR2 667 (PC2 5300) |
| CAS Latency | CL5 |
| Timing | 5-5-5 |
| Voltage | 1.8V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Rank | 2Rx4 |
| Chipset | Major Brand Chipset |
| Heat Spreader | Based on Current Inventory (If Required Please Contact) |
| Compatible System | Hp/Compaq Proliant Dl185 G5 |
| Package Content | 1 Memory RAM Stick |
Each module operates at the standard 1.8 V DDR2 voltage; total power scales with the four 4 GB sticks installed, so the server's own power budget and cooling determine actual draw under load.
The kit is validated for HP/Compaq ProLiant DL185 G5 systems with Opteron third-generation processors; eight sockets are available across two banks per CPU, and kits must be installed in decreasing capacity order.
Mixing single and dual ranked DIMMs on the same processor node disables bank interleaving, so all four slots per node should use matching 2Rx4 modules for 4-way interleaving.
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