BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
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Kingston Technology Corp.
A 4 GB dual-channel DDR3 1066 SO-DIMM kit for Apple notebooks, supplied as two 2 GB modules with 204-pin layout, CAS latency 7 and 1.5 V operation
This kit supplies 4 GB of DDR3 memory in two 2 GB SO-DIMM modules built for Apple notebooks. Each stick runs at 1066 MHz with a CAS latency of 7 and operates at the standard 1.5 V. The 204-pin form factor matches the slots used in compatible Mac models. It is a straightforward capacity upgrade for owners of those machines.
Installing the pair activates dual-channel mode on supported logic boards, which increases memory bandwidth without requiring extra slots. The modules need no heat spreader and draw power only from the SO-DIMM socket. Builders simply insert both sticks into the available memory bays, freeing no other resources and demanding no additional cables or cooling.
Under continuous workloads the memory maintains its rated 1066 MHz speed at the specified 1.5 V. The absence of a heat spreader means the modules rely on the notebook's internal airflow, which is adequate for the low-power DDR3 design. Stability is preserved through Kingston's validation process, delivering 100 percent compatibility with the target Apple systems during extended use.
| Brand | Kingston |
|---|---|
| Model | KTA-MB1066K2/4G |
| Type | 204-Pin DDR3 SO-DIMM |
| Compatibility | For Apple Notebook |
| Capacity | 4GB (2 x 2GB) |
| Speed | DDR3 1066 (PC3 8500) |
| CAS Latency | 7 |
| Voltage | 1.5V |
| Heat Spreader | No |
| Shipping weight | 0.05 kg |
| Package size | 171 × 95 × 13 mm |
The modules run at standard 1.5 V with CAS 7 latency and no heat spreader; thermal throttling is not typical for DDR3 1066 SO-DIMM workloads.
Memory modules produce negligible heat and zero audible noise; system fan speed is unchanged by this 1.5 V kit.
Compatibility is limited to Apple notebooks that use 204-pin DDR3 1066 (PC3 8500) SO-DIMM slots; verify your model before purchase.
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