NEMIX RAM MR25600-624K2 32GB (2x16GB) DDR4 3200 CL22 2Rx4 ECC RDIMM MSI WS WRX80 memory upgrade
- 32GB (2 x 16GB)
- DDR4 3200 (PC4 2560…
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NEMIX RAM
32 GB DDR4 3200 ECC registered DIMM with CL22 latency and 1.2 V operation for Gigabyte MC62-G40 and MC62-G41 servers
Capacity 32GB
This 32 GB DDR4 3200 module is built for Gigabyte MC62-G40 and MC62-G41 server motherboards. Registered operation and ECC protect data integrity in multi-socket workloads. The single-rank 2Rx4 organisation fits dense memory configurations without exceeding slot limits. IT teams specify it when uptime matters more than raw frequency.
The package contains one 32 GB stick, so population rules stay predictable across identical nodes. No heat spreader means unrestricted airflow in tightly packed chassis. CL22 latency at 1.2 V keeps power draw low during sustained compute jobs. Samsung, Micron or Hynix DRAM ensures consistent bin quality across repeat orders.
Registered buffering reduces electrical load on the memory controller, allowing full-channel population. ECC circuitry corrects single-bit errors before they reach the OS. Absence of a spreader eases removal in tool-less trays. Builders who need non-ECC UDIMMs or higher speeds must select a different part.
| Brand | NEMIX RAM |
|---|---|
| Series | Gigabyte Server Motherboard Compatible Series Memory |
| Model | Gigabyte DDR4 3200MHZ ECC RDIMM Registered Server Memory |
| Part Number | MR25600-324K1 |
| Capacity | 32GB |
| Speed | DDR4 3200 (PC4 25600) |
| ECC | Yes |
| Buffered/Registered | Registered |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Voltage | 1.20V |
| Compatible System | GIGABYTE |
| CAS Latency | CL22 |
| Heat Spreader | No |
| Type | 288-Pin DDR4 RDIMM |
| Rank | 2Rx4 |
| Features | DDR4 ECC Registered RDIMM Server Motherboard Compatible |
| Package Content | 32GB (1X32GB) DDR4 3200MHZ PC4-25600 2Rx4 1.2V CL22 288-PIN ECC RDIMM Registered Server Memory |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
No firmware updates or chip replacements are required; the Samsung, Micron or Hynix DRAM chips are fixed on the PCB and the module runs at the standard 1.20 V DDR4 voltage for its lifetime.
The registered buffer and CL22 latency set the timing ceiling; sustained throughput is capped by the DDR4 3200 PC4-25600 specification rather than thermal throttling.
The module has no heat spreader and no moving parts, so it adds only the normal DDR4 DRAM heat to the chassis airflow and generates zero acoustic noise.
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