OWC 4GB DDR3L 1600 PC3L-12800 CL11 204-pin SODIMM for Lenovo Flex 3 1470 1480 1580
- 4GB
- 204-Pin DDR3L Non-E…
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OWC
An 8 GB DDR3-1600 UDIMM upgrade for HP EliteDesk 700 G1, 705 G1 and 705 G2 systems
This 8GB DDR3 1600 module is built for HP EliteDesk 700 G1 SFF, 700 G1 Tower, 705 G1 SFF, 705 G1 Tower and 705 G2 SFF systems. It adds a single 240-pin UDIMM rated at PC3-12800 CL11 to expand memory capacity for everyday workloads.
The unbuffered non-ECC DIMM runs at the standard 1.5V JEDEC voltage without a heat spreader, so it draws minimal power and adds no audible noise to the chassis. Power consumption stays within the platform's default memory budget during normal operation.
Swapping a 4GB or 2GB stick for this 8GB module doubles or quadruples capacity, letting the EliteDesk keep more applications and larger files in memory at once. The jump is worth it when the current configuration forces frequent paging or limits multitasking headroom.
| Brand | OWC |
|---|---|
| Part Number | 1U6D32R808GB |
| Capacity | 8GB |
| Type | 240-Pin DDR3 Non-ECC UDIMM |
| Speed | DDR3 1600 (PC3 12800) |
| CAS Latency | CL11 |
| Voltage | 1.5V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Rank | 2Rx8 |
| Heat Spreader | No |
| Compatible System | HP EliteDesk 700 G1 SFF HP EliteDesk 700 G1 Tower HP EliteDesk 705 G1 SFF HP EliteDesk 705 G1 Tower HP EliteDesk 705 G2 SFF |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
Power off, unplug, open the case, align the notch on the 240-pin DDR3 module with the slot key, press firmly until both retention clips click shut, then power on and verify 8GB appears in BIOS — the step often missed is fully seating both clips.
No scheduled maintenance is required; keep interior dust-free and ensure the 1.5V DIMM stays firmly seated — replacement is only needed if a memory test reports errors or capacity becomes insufficient.
The CL11 latency at 1600 MT/s sets the throughput ceiling; sustained heavy use will hit that bandwidth limit before thermal or voltage constraints become an issue.
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