OWC 64GB (4x16GB) DDR3L 1333 ECC Registered RDIMM memory upgrade
- 64GB (4 x 16GB)
- 240-Pin DDR3L ECC R…
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OWC
64GB DDR3L 1600 ECC registered kit of four 16GB modules for Cisco UCS B260 M4 and B460 M4 servers
Capacity 64GB (4 x 16GB)
This 64GB kit contains four 16GB DDR3L 1600 registered DIMMs with ECC and a CL11 latency. Modules run at 1.35V and use the 240-pin form factor with a 2Rx4 organisation. The kit is validated for Cisco UCS B260 M4 and B460 M4 servers using E7 v2 and v3 processors.
This memory fits only systems that accept DDR3L 1600 registered ECC RDIMMs at 1.35V. It will not work in standard desktops, consumer laptops or any platform that requires unbuffered or load-reduced DIMMs. Builders needing non-ECC or higher-speed modules should look elsewhere.
The modules are registered ECC with a 2Rx4 rank structure, a requirement for the target Cisco UCS platforms. Mixing these with unbuffered or load-reduced memory is not supported. Verify that your server requires registered ECC RDIMMs before ordering.
| Brand | OWC |
|---|---|
| Part Number | 1R6T32R4064S |
| Capacity | 64GB (4 x 16GB) |
| Type | 240-Pin DDR3L ECC RDIMM |
| Speed | DDR3L 1600 (PC3L 12800) |
| CAS Latency | CL11 |
| Voltage | 1.35V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Rank | 2Rx4 |
| Heat Spreader | No |
| Compatible System | Cisco UCS B260 M4 E7 v2 & v3 Cisco UCS B460 M4 E7 v2 & v3 |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
Power down the server, open the chassis, align each module's notch with the slot key, press firmly until both ejector clips click, then verify in BIOS that all 64 GB are detected at 1600 MHz CL11.
The modules have no moving parts and no heat spreaders; only periodic dust removal from the DIMM slots is required, and a failed stick would be replaced individually under the manufacturer's limited lifetime warranty.
The registered buffer and ECC logic add one cycle of latency, so memory-controller throughput saturates before the 1600 MT/s data rate or 1.35 V thermal envelope becomes a bottleneck.
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