GIGABYTE B850M EAGLE WF6E ICE AMD motherboard
- AM5
- Ryzen 7000 Series /…
GIGABYTE
Micro ATX AM5 board with DDR5 up to 8200, PCIe 5.0, two M.2 slots, WIFI6E, 2.5GbE LAN and DIY-friendly EZ-Latch
Option B850M A ELT WF6E ICE
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This micro ATX motherboard uses the AMD B850 chipset and an AM5 socket. It accepts Ryzen 7000, 8000 and 9000 series processors. Four 288-pin DDR5 slots support up to 256 GB of memory at speeds reaching DDR5 8200 when overclocked. A 12+2+2 phase power design feeds the CPU.
The board includes a VRM thermal guard and an M.2 thermal guard to manage heat during normal operation. A single PCI Express 5.0 x16 slot and two M.2 slots provide high-speed expansion. Networking uses 2.5 Gbps LAN and Wi-Fi 802.11 ax with Bluetooth. Rear I/O supplies DisplayPort, USB 3.2 Gen 2 Type-C, two USB 3.2 Gen 2 Type-A, four USB 2.0 and five USB 3.2 Gen 1 ports.
M.2 EZ-Latch and PCIe EZ-Latch allow tool-free installation of drives and cards. Wi-Fi EZ-Plug simplifies antenna attachment. The BIOS includes X3D Turbo Mode, which can raise gaming frame rates by up to 18 percent on compatible Ryzen 9000 processors. AORUS AI SNATCH and HyperTune BIOS apply AI-driven overclocking and signal optimisation for memory and system tuning.
| Brand | GIGABYTE |
|---|---|
| Model | B850M AORUS ELITE WIFI6E ICE |
| CPU Socket Type | AM5 |
| CPU Type | Ryzen 7000 Series / Ryzen 8000 Series / Ryzen 9000 Series |
| Chipset | AMD B850 |
| Number of Memory Slots | 4x288pin (DDR5) |
| Memory Standard | Up to DDR5 8200(O.C) |
| Maximum Memory Supported | 256GB |
| PCI Express 5.0 x16 | 1 x PCI Express 5.0 x16 |
| M.2 | 2 x M.2 |
| Max LAN Speed | 2.5Gbps |
| Wireless LAN | Wi-Fi 802.11 ax |
| Bluetooth | Yes |
| Back I/O Ports | 1 x DisplayPort / 1 x USB 3.2 Gen 2 Type-C / 2 x USB 3.2 Gen 2 Type-A / 4 x USB 2.0/1.1 / 5 x USB 3.2 Gen 1 |
| Form Factor | Micro ATX |
| 出貨重量 | 1.81 kg |
| 包裝尺寸 | 279 × 267 × 76 mm |
其他版本
同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。
Align the notch on the DDR5 stick with the key in the 288-pin slot, press down firmly until both side clips snap shut, then verify the BIOS detects the full 256 GB capacity.
The VRM and M.2 Thermal Guard heatsinks rely on case airflow; dust buildup reduces cooling efficiency, so clean the fins periodically to maintain the 12+2+2 power delivery temperatures.
The 12+2+2 phase VRM thermal ceiling is reached before the PCIe 5.0 x16 or dual M.2 interfaces saturate, so adequate chassis ventilation becomes the limiting factor.
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