NEMIX RAM 16GB DDR5 5600 CL46 2x8GB Supermicro X13SAQ memory upgrade
- 16GB (2 x 8GB)
- 288-Pin DDR5 UDIMM
NEMIX RAM
32 GB DDR4 ECC UDIMM at 3200 MHz CL22, validated for Supermicro X12STE-F and X12STD-F boards
Size 32GB
This 32GB DDR4-3200 module is built as an exact-match upgrade for Supermicro X12STE-F and X12STD-F motherboards. It uses the 288-pin unbuffered ECC UDIMM form factor those boards require with 2Rx8 rank organization. The CL22 timing and 1.2V voltage match the memory controller specification for full-speed operation. Buyers needing registered DIMMs or non-ECC memory should look elsewhere.
Operating at the standard 1.2V DDR4 voltage the module draws minimal power during typical workloads. No heat spreader is fitted so the chips rely on case airflow for cooling which is sufficient for normal server or workstation duty. The unbuffered design adds no active components that would increase noise or thermal output. Systems with restricted airflow should verify adequate circulation around the DIMM slots.
Error-correcting code detects and corrects single-bit errors on the fly preventing silent data corruption during extended compute sessions. The 2Rx8 organization and CL22 latency are maintained at the rated 3200MHz speed under continuous load. Population rules in the motherboard manual determine maximum capacity and slot order for stable multi-DIMM configurations.
| Brand | NEMIX RAM |
|---|---|
| Series | NEMIX RAM Original Series Memory |
| Model | DDR4 ECC Unbuffered UDIMM Memory |
| Part Number | ME25600-328K1 |
| Capacity | 32GB |
| Type | 288-Pin DDR4 ECC UDIMM |
| Speed | DDR4 3200 (PC4 25600) |
| CAS Latency | CL22 |
| Voltage | 1.20V |
| ECC | Yes |
| Buffered/Registered | Unbuffered |
| Rank | 2Rx8 |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Heat Spreader | No |
| Compatible System | Supermicro |
| Features | DDR4 ECC Unbuffered UDIMM Motherboard Compatible |
| Package Content | 32GB DDR4 3200MHz PC4-25600 2Rx8 1.2V 288-PIN ECC UDIMM KIT |
其他版本
同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。
Power down the system, open the chassis, align the notch on the 288-pin DDR4 ECC UDIMM with the slot key, press firmly until both retention clips click, then follow the motherboard manual's DIMM population sequence for the X12STE-F or X12STD-F to ensure the 32 GB module is recognised at full speed.
The DRAM chips from Samsung, Micron or Hynix are fixed hardware with no firmware to update, and the module itself has no moving parts or consumable components, so no scheduled replacement is required under normal operation.
The CL22 timing at DDR4-3200 sets the minimum access delay for every read or write cycle, so under sustained memory-intensive workloads the latency bound is reached before bandwidth saturation, limiting throughput to the rate allowed by those 22 cycles per operation.
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