BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
OWC
A 16 GB DDR4 ECC unbuffered DIMM running at 2666 MT/s with CL19 latency for Supermicro X11SAE, X11SAE-F, X11SAT, X11SAT-F and X11SCA motherboards
This 16 GB DDR4 2666 module is built for Supermicro X11SAE, X11SAE-F, X11SAT, X11SAT-F and X11SCA motherboards. It delivers ECC protection and unbuffered operation in a very low profile form factor. The single DIMM upgrades compatible systems with JEDEC-standard reliability.
Operating at 1.2 V, the module runs cool without a heat spreader. The very low profile height keeps airflow clear in dense server chassis. Unbuffered design avoids the extra power draw of registered DIMMs. Standard DDR4 2666 timing maintains efficient power use under load.
The dual-rank 2Rx8 organisation with CL19 latency defines the module’s throughput on these platforms. Buyers needing higher capacity per slot or registered ECC should verify board support before ordering. This part is not for systems that require RDIMM or LRDIMM modules.
| Brand | OWC |
|---|---|
| Part Number | 2E6V42R816GB |
| Capacity | 16GB |
| Type | 288-Pin DDR4 ECC VLP UDIMM |
| Speed | DDR4 2666 (PC4 21300) |
| CAS Latency | CL19 |
| Voltage | 1.2V |
| ECC | Yes |
| Buffered/Registered | Unbuffered |
| Rank | 2Rx8 |
| Heat Spreader | No |
| Compatible System | Supermicro Motherboard X11SAE Supermicro Motherboard X11SAE-F Supermicro Motherboard X11SAT Supermicro Motherboard X11SAT-F Supermicro Motherboard X11SCA |
Align the notch on the 288-pin DDR4 module with the slot key, press down firmly until both retention clips click, and verify the VLP height clears any CPU cooler — the step often missed is confirming both clips are fully locked.
No routine maintenance is required; if a correctable error count rises or the module fails, replace it with an identical 16GB DDR4 2666 CL19 2Rx8 VLP ECC UDIMM to keep matched capacity and timing.
The CAS latency of CL19 at DDR4 2666 sets the timing ceiling; sustained workloads will hit that latency bound before voltage or thermal limits become a factor.
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