ASUS TUF GAMING B860-PLUS WIFI + Ultra 5 245K Intel motherboard combo
- LGA 1851
- Intel B860
Sprejemamo kriptovalute — tako lahko sredstva, ki jih imate, kupijo pravo strojno opremo.Plačajte v kriptovaluti, zapravite jo za pravo strojno opremo. Brezplačna zavarovana dostava po vsem svetu nad 399 $. Nevtralni kartoni brez znamke, poslani iz Nemčije.Brezplačna zavarovana dostava nad 399 $. Vaš tečaj je zaklenjen za 30 minut, takoj ko se odpre blagajna.Tečaj zaklenjen 30 minut. Vsak izdelek je zapečaten, njegova serijska številka preverjena, in krit z 24-mesečno garancijo.Zapečateno, 24-mesečna garancija.
ASUS
A motherboard and CPU combo with DDR5 support, PCIe 5.0 graphics slot, dual M.2 storage, 2.5Gb Ethernet and included thermal paste
model PRIME B860M-A
+CPU +Ultra 7 265K
This bundle pairs the ASUS PRIME B860M-A motherboard with an Intel Core Ultra 7 265K processor and a tube of Shin-Etsu X-23-7868-2D thermal grease. The board uses the Intel B860 chipset and an LGA 1851 socket. It is sold as a single package for builders who want matched components without separate purchases.
The motherboard provides a 7(80A)+1(80A)+1(80A)+1(80A) DrMOS power stage array fed by a ProCool 8-pin connector. The included CPU has a 125 W base power rating and 3nm Arrow Lake architecture. A 2.5 Gb Ethernet controller with Digi+ VRM power control handles wired networking on the rear I/O.
AEMP 3.0 technology enables DDR5-7600+ operation while DIMM FIT checks stability during overclocking. The I/O shield comes pre-mounted on the board to simplify case installation. The supplied thermal grease offers 6.2 W/m.k conductivity, 0.07 °C*cm²/W resistance, 100 Pa.s viscosity and a suggested two-year replacement cycle.
| Brand | ASUS |
|---|---|
| Model | PRIME B860M-A+Ultra 7 265K |
| CPU Socket Type | LGA 1851 |
| Chipset | Intel B860 |
Druge različice tega modela
Ista družina, različen pomnilnik, hladilnik ali takt — primerjajte, preden se odločite.
Lift the socket lever, align the processor triangle with the socket mark, lower the CPU gently without pressure, then close and latch the lever — the common error is pressing the chip down before the lever is fully locked.
The manufacturer suggests replacing the paste every 2 years; its thermal conductivity is 6.2 W/m·k and resistance 0.07 °C·cm²/W, so re-application restores optimal heat transfer.
The 125 W processor power draw combined with the 80 A DrMOS VRM stages means VRM temperature becomes the first bottleneck under prolonged heavy load.
Tudi v tem oddelku
Ista polica, ista blagajna — osem kriptovalut in 30-minutni zaklep tečaja.
V čem plačujete in v čem berete cene.
Poslano iz Vaše denarnice ob blagajni
Samo za prikaz — katalog je cenovno izražen v dolarjih
Nobena valuta ne ustreza.
Izberite jezik, v katerem Vam govori spletna stran.
Prvič tu?
Že imate račun?
Samodejne ponastavitve ni: ta trgovina ne pošilja e-pošte, zato ni enkratne povezave, ki bi jo lahko zahtevali. Pustite naslov na računu — nekdo ga bo obravnaval ročno.
Zahteva zabeležena
V Vašo elektronsko pošto ne prihaja nič — ta trgovina ne pošilja nobene e-pošte. Zahteve nekdo obravnava ročno.
Ste se spomnili?