OWC 16GB (2x8GB) DDR3 1333 ECC Registered RDIMM Kit Supermicro 5086B 8026B 8046B
- 16GB (2 x 8GB)
- 240-Pin DDR3 ECC RD…
OWC
16 GB DDR3 1333 ECC registered RDIMM kit for HP ProLiant G6/G7 servers
Capacity 16GB (2 x 8GB)
This 16GB kit contains two 8GB DDR3 1333 registered DIMMs built to PC3-10600 CL9 timings at 1.5V. It is designed for HP ProLiant DL360 G7, DL370 G6, DL380 G7, DL385 G7 and DL580 G7 servers that require ECC registered memory. Standard desktop systems cannot use these modules.
The modules operate at the standard 1.5V DDR3 voltage with no heat spreader, relying on server chassis airflow for cooling. Registered buffering reduces electrical load on the memory controller, helping keep power draw predictable in multi-DIMM configurations. No active cooling or additional fan speed is required beyond the server's stock thermal design.
This kit replaces HP part numbers such as 500205071, 500662B21, 593913B21 and A0R56A, matching the original 1333 MHz registered ECC specification. It is not compatible with unbuffered UDIMMs, so mixed populations are not supported. Builders who need capacities beyond 16GB per channel or speeds above DDR3 1333 must select different modules.
| Brand | OWC |
|---|---|
| Part Number | 1R3D32R4016P |
| Capacity | 16GB (2 x 8GB) |
| Type | 240-Pin DDR3 ECC RDIMM |
| Speed | DDR3 1333 (PC3 10600) |
| CAS Latency | CL9 |
| Voltage | 1.5V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Rank | 2Rx4 |
| Heat Spreader | No |
| Compatible System | HP ProLiant DL360 G7 HP ProLiant DL370 G6 HP ProLiant DL380 G7 HP ProLiant DL385 G7 HP ProLiant DL580 G7 |
其他版本
同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。
Power down the server, open the chassis, and insert each 8 GB module into the correct DIMM slot for its CPU channel; the common mistake is populating slots for a second processor that isn't installed, which leaves the memory unrecognised.
No routine maintenance is required; if a module fails, replace the faulty 8 GB RDIMM with an identical DDR3 1333 CL9 2Rx4 1.5 V part to keep ECC and registered operation consistent.
The DDR3 1333 bus and CL9 latency set the throughput ceiling, so memory bandwidth saturates before the 16 GB capacity or the 1.5 V thermal envelope becomes the bottleneck.
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