نقبل الدفع بالعملة المشفرة — لذلك يمكن للعملات الرقمية التي تملكها أن تشتري أجهزة حقيقية.ادفع بالعملة المشفرة، وأنفقها على أجهزة حقيقية. شحن مؤمن مجانا إلى كل أنحاء العالم لما يتجاوز 399 US$. صناديق شحن بسيطة بلا علامة تجارية، ترسل من ألمانيا.شحن مؤمن مجانا لما يتجاوز 399 US$. يُقفل سعرك لمدة 30 دقيقة بمجرد فتح صفحة الدفع.السعر مقفل لمدة 30 دقيقة. كل قطعة مختومة، ورقمها التسلسلي متحقق منه، ومشمولة بضمان 24 شهرا.مختوم، وبضمان 24 شهرا.

قائمة الرصد تسجيل الدخول
ASUS TUF B850-E ATX motherboard with AM5 socket, large VRM heatsinks, three M.2 shields, pre-mounted I/O shield

ASUS

ASUS TUF GAMING B850-E WIFI AMD motherboard & Ryzen 9 9900X3D CPU combo

SKU CH-KV48-R9HMA

Pairs an AM5 motherboard with a 12-core Ryzen 9 9900X3D, DDR5 support, PCIe 5.0 M.2, Wi-Fi 6E and 2.5Gb Ethernet

  • CPU Socket TypeAM5

Motherboard TUF GAMING B850-E WIFI

عرض 3 تكوينات إضافية

CPU + Ryzen 9 9900X3D

  • Ready for advanced AI workloads with power and connectivity for demanding applications
  • Stable power delivery via 8+2+1 80A DrMOS stages, 8-layer PCB and ProCool connectors
  • Fast storage options with one PCIe 5.0 M.2 slot and two PCIe 4.0 M.2 slots
  • Ultrafast connectivity through Wi-Fi 6E, 2.5Gb Ethernet, USB 20Gbps Type-C front and USB 10Gbps Type-C rear
  • High-performance Ryzen 9 9900X3D CPU with 128MB L3 cache and Radeon graphics

Combo for AI-ready desktop builds

This bundle pairs the ASUS TUF GAMING B850-E WIFI motherboard with an AMD Ryzen 9 9900X3D processor. The board uses the AMD AM5 socket and supports Ryzen 7000, 8000 and 9000 series CPUs. It targets enthusiasts who want a single package for advanced AI workloads and high-end gaming. DDR5 memory is required for operation.

Enlarged VRM heatsink with 80A DrMOS stages

An 8+2+1 power design uses 80A DrMOS stages on an 8-layer PCB with alloy chokes and durable capacitors. Enlarged VRM and PCH heatsinks join a flexible M.2 heatsink and hybrid fan headers managed by Fan Xpert 4. The CPU has a 120W base power rating. Cooling capacity scales with the installed cooler and case airflow.

128MB L3 cache on the Ryzen 9 9900X3D

The processor delivers 128MB of L3 cache and 12MB of L2 cache built on TSMC 4nm FinFET Granite Ridge Zen 5 architecture. Integrated AMD Radeon graphics provide display output without a discrete card. This cache size is the key differentiator for latency-sensitive gaming and AI tasks. Ensure your cooler and power supply match the 120W thermal design.

أبرز المميزات

  • Ready for advanced AI workloads with power and connectivity for demanding applications
  • Stable power delivery via 8+2+1 80A DrMOS stages, 8-layer PCB and ProCool connectors
  • Fast storage options with one PCIe 5.0 M.2 slot and two PCIe 4.0 M.2 slots
  • Ultrafast connectivity through Wi-Fi 6E, 2.5Gb Ethernet, USB 20Gbps Type-C front and USB 10Gbps Type-C rear
  • High-performance Ryzen 9 9900X3D CPU with 128MB L3 cache and Radeon graphics

المواصفات

BrandASUS
ModelTUF GAMING B850-E WIFI+R9 9900X3D
CPU Socket TypeAM5

إصدارات أخرى من هذا الطراز

5 أخرى من الفئة نفسها

نفس الفئة، بذاكرة أو مبرّد أو تردد مختلف — قارن قبل أن تقرر.

أسئلة حول هذا المنتج

How do I install the Ryzen 9 9900X3D into the AM5 socket, and what step do people get wrong?

Align the triangle on the CPU with the socket marker, lower it gently without pressure, then close the retention arm; the common mistake is forcing the chip before the arm is fully latched, which can bend the delicate contact pads.

What maintenance or replacement will the 120W Ryzen 9 9900X3D need later?

Plan to renew the thermal paste every few years and clean dust from the enlarged VRM heatsink, M.2 heatsink and PCH heatsink so the comprehensive cooling keeps the 128MB L3 cache processor stable.

What limit appears first when the 8+2+1 80A DrMOS power stages run sustained loads?

The VRM temperature ceiling is reached before the 8-layer PCB or ProCool connectors saturate, so adequate case airflow over the enlarged heatsink becomes the limiting factor.

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