ASUS PRIME B860M-K Intel motherboard & Ultra 5 245K CPU combo with Shin-Etsu X-23-7868-2D thermal grease
- LGA 1851
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ASUS
A motherboard and CPU bundle with Thunderbolt 4, DDR5-9066+ memory support, WiFi 7 and included Shin-Etsu thermal grease
model ROG STRIX B860-F GAMING WIFI
+CPU +Ultra 7 265K
This bundle pairs the ROG STRIX B860-F GAMING WIFI motherboard with the Intel Ultra 7 265K processor and Shin-Etsu X-23-7868-2D thermal grease. The board uses the Intel B860 chipset and LGA 1851 socket. It is built for users who want a matched platform without selecting parts separately. The included paste has a 6.2 W/m.k conductivity rating.
The motherboard supports DDR5-9066+(OC) via AEMP III and DIMM Fit Pro. It provides one PCIe 5.0 x16 SafeSlot, one PCIe 5.0 M.2 slot at 128Gbps and three PCIe 4.0 M.2 slots with heatsinks. Connectivity includes WiFi 7, Intel 2.5Gb LAN, Thunderbolt 4, rear USB 20Gbps Type-C and a front USB 10Gbps Type-C header. Builders needing a different socket or chipset should look elsewhere.
The power stage uses sixteen 80A, one 80A, two 80A and one 80A DrMOS stages fed by dual 8-pin ProCool connectors. NPU Boost technology delivers a 24 percent AI performance gain. The CPU runs at a 125W base with 30MB L3 and 36MB L2 cache. The thermal grease offers 0.07 °C*cm²/W resistance and 100 Pa.s viscosity for stable long-term contact.
| Brand | ASUS |
|---|---|
| Model | ROG STRIX B860-F GAMING WIFI+Ultra 7 265K |
| CPU Socket Type | LGA 1851 |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
Yes, the syringe contains enough compound for multiple applications on the LGA 1851 heatspreader; its 6.2 W/m·k conductivity and 100 Pa·s viscosity spread easily with light pressure.
The board wires one PCIe 5.0 x16 SafeSlot for the GPU and one PCIe 5.0 M.2 slot at 128 Gbps for a primary SSD, so both run at full Gen 5 speed together.
The ASUS AEMP III profile is validated up to 9066 MT/s; speeds beyond that require manual tuning and are not guaranteed stable.
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