ASUS TUF Gaming B650M-E + Ryzen 5 9600X AMD motherboard & CPU combo
- AM5
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ASUS
An AM5 motherboard and Ryzen 7 9700X CPU combo with 16+2+1 80A power stages, DDR5 4400 support up to 256GB, PCIe 5.0 x16, dual PCIe 5.0 M.2 slots, WiFi 7, 2.5Gb LAN and dual USB4 40Gbps Type-C ports
Motherboard TUF GAMING X870-PLUS WIFI
CPU + R7 9700X
The ASUS TUF GAMING X870-PLUS WIFI motherboard paired with the AMD Ryzen 7 9700X forms a complete AM5 platform. The board delivers 16+2+1 80A SPS power stages on an 8-layer PCB for stable delivery. The CPU provides 8 cores and 16 threads based on Zen 5 architecture with a max boost clock of 5.5 GHz. This combination suits enthusiasts building a high-performance desktop for gaming and AI workloads.
The motherboard uses alloy chokes, durable capacitors and ProCool connectors to support efficient power delivery. Massive M.2 heatsinks cover the two PCIe 5.0 slots and two PCIe 4.0 slots to manage storage temperatures. AI Cooling II adjusts fan curves across the 4-pin CPU, CPU OPT, AIO pump and chassis headers. The Realtek ALC1220P codec with an internal amplifier handles audio without adding active cooling noise.
AI Overclocking, Dynamic OC Switcher, Core Flex and PBO Enhancement adapt voltage and frequency during extended workloads. The 80A power stages and 8-layer PCB maintain consistent current for the unlocked 9700X. Four DDR5 slots support up to 256 GB at 4400 with EXPO and AEMP profiles for memory stability. Dual USB4 40Gbps ports, Wi-Fi 7 and 2.5Gb Ethernet sustain high-throughput connectivity without throttling.
| Brand | ASUS |
|---|---|
| Model | TUF GAMING X870-PLUS WIFI+R7 9700X |
| Chipset | AMD X870 |
| Number of Memory Slots | 4x288pin (DDR5) |
| Memory Standard | DDR5 4400 |
| Maximum Memory Supported | 256GB |
| Channel Supported | Dual Channel |
| ECC Supported | Yes |
| Buffer Supported | Un-buffered |
| Memory Feature | Dual channel memory architecture Supports AMD Extended Profiles for Overclocking (EXPO) ASUS Enhanced Memory Profile (AEMP) * Non-ECC, un-buffered DDR5 memory supports On-Die ECC function. |
| PCI Express 5.0 x16 | AMD Ryzen 9000 & 7000 Series Desktop Processors 1 x PCIe 5.0 x16 slot (supports x16 mode) |
| PCI Express 4.0 x16 | AMD Ryzen 8000 Series Desktop Processors 1 x PCIe 4.0 x16 slot (supports x8/x4 mode) |
| M.2 | AMD Ryzen 9000 & 7000 Series Desktop Processors M.2_1 slot (Key M), type 2280 (supports PCIe 5.0 x4 mode) M.2_2 slot (Key M), type 2280 (supports PCIe 5.0 x4 mode)** AMD Ryzen 8000 Series Desktop Processors M.2_1 slot (Key M), type 2280 (supports PCIe 4.0 x4 mode) M.2_2 slot not support AMD X870 Chipset M.2_3 slot (Key M), type 2280 (supports PCIe 4.0 x4 mode) M.2_4 slot (Key M), type 2242/2260/2280/22110 (supports PCIe 4.0 x4 mode)*** ** The PCIEX16(G5) shares bandwidth with M.2_2. The PCIEX16(G5) will run to x8 mode when M.2_2 runs. *** The PCIEX16(G4) shares bandwidth with M.2_4. |
| SATA RAID | * AMD RAIDXpert2 Technology supports both PCIe RAID 0/1/5/10 and SATA RAID 0/1. RAID 5 Funciton is only supportted by AMD Ryzen 9000 series CPU. |
| Audio Chipset | Realtek ALC1220P 7.1 Surround Sound High Definition Audio CODEC - Impedance sense for front and rear headphone outputs - Internal audio Amplifier to enhance the highest quality sound for headphone and speakers - Supports: Jack-detection, Multi-streaming, Front Panel Jack-retasking - High quality 120 dB SNR stereo playback output and 113 dB SNR recording input (Line-in) - Supports up to 32-Bit/192 kHz playback* Audio Features - Audio Shielding - Premium audio capacitors - Dedicated audio PCB layers - Audio cover - Unique de-pop circuit * Due to limitations in HDA bandwidth, 32-Bit/192 |
| Audio Channels | 7.1 Channels |
| Back I/O Ports | 2 x USB4 (40Gbps) (2 x USB Type-C) 3 x USB 10Gbps ports (3 x Type-A) 4 x USB 5Gbps ports (4 x Type-A) 1 x USB 2.0 port (1 x Type-A) 1 x HDMI port 1 x Wi-Fi module 1 x Realtek 2.5Gb Ethernet port 5 x Audio jacks 1 x BIOS FlashBack button |
| Onboard USB | 1 x USB 20Gbps connector (supports USB Type-C with up to 30W PD Fast-charge ) 1 x USB 5Gbps header supports 2 additional USB 5Gbps ports 2 x USB 2.0 headers support 4 additional USB 2.0 ports |
| Other Connectors | Fan and Cooling Related 1 x 4-pin CPU Fan header 1 x 4-pin CPU OPT Fan header 1 x 4-pin AIO Pump header 4 x 4-pin Chassis Fan headers 1 x W_PUMP+ header Miscellaneous 3 x Addressable Gen 2 headers 1 x Clear CMOS header 1 x Chassis Intrusion header 1 x COM Port header 1 x Front Panel Audio header (F_AUDIO) 1 x 10-1 pin System Panel header 1 x Thermal Sensor header |
| Form Factor | ATX |
| Dimensions (W x L) | 12.0" x 9.6" |
| Power Pin | 1 x 24-pin Main Power connector 2 x 8-pin +12V CPU Power connectors |
| BIOS Feature | 256 Mb Flash ROM, UEFI AMI BIOS |
| Windows 11 | Supported |
| Features | ASUS TUF PROTECTION - DIGI+ VRM (- Digital power design with SPS) - ESD Guards - TUF LANGuard - Overvoltage protection - SafeSlot - Stainless-steel back I/O ASUS Q-Design - M.2 Q-Latch - PCIe Slot Q-Release - Q-Antenna - Q-Dashboard - Q-DIMM - Q-LED (CPU [red], DRAM [yellow], VGA [white], Boot Device [yellow green]) - Q-Slot ASUS Thermal Solution - M.2 heatsink - VRM heatsink design ASUS EZ DIY - BIOS FlashBack button - BIOS FlashBack LED - ProCool - Pre-mounted I/O shield - SafeDIMM Aura Sync - Addressable Gen 2 headers Front Panel USB 20Gbps with PD Fast Charge Support - Support: u |
| Package Contents | 1 x AMD Ryzen 7 9700X CPU Cables 2 x SATA 6Gb/s cables Miscellaneous 1 x ASUS WiFi Q-Antenna 2 x M.2 rubber packages 1 x Screw package for M.2 SSD 1 x TUF GAMING sticker Documentation 1 x TUF certification card 1 x Quick start guide |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
Align the gold triangle on the Ryzen 7 9700X with the socket marker, lower it gently without force, and lock the retention arm; the step many miss is removing the protective cover from the motherboard socket before seating the processor.
The CMOS battery on the board will eventually need replacement to keep BIOS settings and system time; fan headers and the W_PUMP+ header should be checked for dust buildup, and the M.2 heatsinks may need reapplication of thermal pads if drives are swapped.
The VRM heatsink thermal capacity is the first bottleneck during prolonged all-core workloads, as the 16+2+1 80A power stages can deliver more current than the heatsinks dissipate without additional case airflow.
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