AMD EPYC 9454 100-000000478 server processor 48-core 2.75 GHz 256 MB L3 290 W
- EPYC 9454
- Socket SP5
AMD
84-core server processor running at 2.25 GHz with 384 MB L3 cache, 128 PCIe 5.0 lanes and 12-channel DDR5-4800 support
Option EPYC 9634
The AMD EPYC 9634 is a server-grade CPU built for heavily threaded data-centre workloads. It delivers 84 cores and 168 threads at a 2.25 GHz base clock with a 3.1 GHz maximum turbo frequency. This processor targets operators running virtualisation clusters, large databases or high-performance computing tasks that scale across many threads.
The chip fits the SP5 socket and exposes 128 lanes of PCI Express 5.0 for high-bandwidth accelerators, storage and networking. Twelve DDR5-4800 memory channels feed the 384 MB L3 and 84 MB L2 caches. No cooling solution is included, so a compatible 360 W thermal solution must be sourced separately for reliable operation.
A 360-watt thermal design power defines the infrastructure needed: substantial airflow, adequate power delivery and rack space for heat dissipation. Buyers who cannot provision that level of cooling or who need a lower-power part for dense deployments should evaluate other SKUs.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 9004 |
| Name | EPYC 9634 |
| Model | 100-000000797 |
| CPU Socket Type | Socket SP5 |
| # of Cores | 84-Core |
| # of Threads | 168 |
| Operating Frequency | 2.25 GHz |
| Max Turbo Frequency | 3.1 GHz |
| L3 Cache | 384MB |
| 64-Bit Support | Yes |
| Integrated Memory Controller Speed | DDR5 4800 |
| Memory Channel | 12 Channel |
| PCI Express Revision | 5.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 360W |
| Cooling Device | Cooling device not included - Processor Only |
| 出貨重量 | 0.45 kg |
| 包裝尺寸 | 25 × 25 × 25 mm |
其他版本
同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。
The processor provides PCI Express 5.0 with up to 128 lanes for high-bandwidth add-in cards and storage.
It fits Socket SP5; no cooling device is included, so a compatible SP5 heatsink rated for 360 W TDP must be sourced separately.
Align the SP5 land-grid array with the socket keys, lower the carrier frame, torque the captive screws in the prescribed sequence, then apply thermal interface material before mounting the heatsink — skipping the torque pattern or paste causes uneven contact and throttling.
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