Solidigm D5-P5336 30.72TB enterprise SSD SBFPF2BV307TOF1
- U.2 15mm
- 30.72TB
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Solidigm
30.72 TB enterprise SSD in a 9.5 mm E1.L form factor with PCIe 4.0 interface and 192-layer QLC 3D NAND
Option 30.72TB E1.L
Struck-through versions exist but are not stocked here.
The Solidigm D5-P5336 provides 30.72TB of capacity in an E1.L 9.5mm form factor using 192-layer QLC 3D NAND. It connects via PCI-Express 4.0 x4 and is built for data-centre servers that prioritise density and read throughput over write endurance.
The drive slides into a standard E1.L 9.5mm slot and secures with the chassis latch; no cables are required. Ensure the backplane supports PCIe 4.0 x4 and that airflow meets the 0°C to +70°C operating range, otherwise thermal throttling or detection failures can occur.
At 30.72TB this single module replaces multiple smaller drives in archive, content-delivery or object-store clusters where sequential reads dominate. Systems needing sustained random writes or higher write-endurance ratings should evaluate alternative media.
| Brand | Solidigm |
|---|---|
| Series | D5-P5336 |
| Model | D5-P5336 |
| Form Factor | E1.L 9.5mm |
| Capacity | 30.72TB |
| Memory Components | 192 L QLC 3D NAND |
| Interface | PCI-Express 4.0 |
| MTBF | 2,000,000 hours |
| Operating Temperature | 0°C ~ +70°C |
| Max Shock Resistance | 1,000 G (Max) at 0.5 msec |
| Max Vibration Resistance | Operating: 2.17 GRMS (5 - 700 Hz) Max Non-Operating: 3.13 GRMS (5 - 800 Hz) Max |
| Shipping weight | 0.37 kg |
| Package size | 369 × 120 × 54 mm |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
Verify the drive appears in your server BIOS or OS disk utility at the full 30.72TB capacity with a PCIe 4.0 x4 link, then run a SMART health check to confirm the 192-layer QLC NAND reports zero media errors and a temperature between 0°C and 70°C.
The single-pack drive ships as the bare E1.L 9.5mm module only; you must supply a compatible E1.L backplane or carrier, PCIe 4.0 cabling or riser, and any required mounting screws or thermal pads for your specific chassis.
The 30.72TB model provides the highest density in the E1.L 9.5mm form factor using 192-layer QLC 3D NAND, maximising rack space efficiency for read-heavy workloads while delivering a 2,000,000-hour MTBF rating.
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